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公开(公告)号:US20230220531A1
公开(公告)日:2023-07-13
申请号:US17796886
申请日:2021-03-04
Applicant: TOCALO CO., LTD.
Inventor: Kazuo HAMASHIMA , Masashi MORISASA , Shinsuke ANAI
CPC classification number: C23C4/06 , H01J37/32495 , C23C4/134
Abstract: To provide a new tungsten-based thermal spray coating suitable as e.g. a component for plasma etching device using halogen gas, and a material for thermal spraying for obtaining the thermal spray coating.
A thermal spray coating characterized by containing tungsten as a matrix phase and oxides containing silicon and boron as a dispersed phase, and a component for plasma etching device having such a thermal spray coating. A material for thermal spraying characterized by containing from 1 to 7 wt % of silicon, from 0.5 to 3 wt % of boron and the reminder being tungsten and unavoidable impurities, and a method for producing a thermal spray coating by thermally spraying the material for thermal spraying.