NEW TUNGSTEN-BASED THERMAL SPRAY COATING AND MATERIAL FOR THERMAL SPRAYING TO OBTAIN IT

    公开(公告)号:US20230220531A1

    公开(公告)日:2023-07-13

    申请号:US17796886

    申请日:2021-03-04

    CPC classification number: C23C4/06 H01J37/32495 C23C4/134

    Abstract: To provide a new tungsten-based thermal spray coating suitable as e.g. a component for plasma etching device using halogen gas, and a material for thermal spraying for obtaining the thermal spray coating.
    A thermal spray coating characterized by containing tungsten as a matrix phase and oxides containing silicon and boron as a dispersed phase, and a component for plasma etching device having such a thermal spray coating. A material for thermal spraying characterized by containing from 1 to 7 wt % of silicon, from 0.5 to 3 wt % of boron and the reminder being tungsten and unavoidable impurities, and a method for producing a thermal spray coating by thermally spraying the material for thermal spraying.

Patent Agency Ranking