公开(公告)号：US20180105690A1

公开(公告)日：2018-04-19

申请号：US15562544

申请日：2016-03-30

Applicant: TOHO TENAX CO., LTD.

Inventor： Toru KANEKO ,  Yuko OKANO

IPC: C08L63/00 ,  C08J5/24 ,  B29C70/34 ,  B32B3/12 ,  B32B5/24

CPC classification number: C08L63/00 ,  B29C43/02 ,  B29C43/12 ,  B29C70/342 ,  B29K2105/0881 ,  B29K2307/04 ,  B29K2663/00 ,  B29L2009/00 ,  B32B3/12 ,  B32B5/245 ,  B32B37/10 ,  C08G59/40 ,  C08J5/24 ,  C08J2363/00 ,  C08J2433/10 ,  C08J2477/00 ,  C08J2481/06 ,  C08K5/21 ,  C08K5/315 ,  C08L33/10 ,  C08L101/00 ,  C08L2205/02 ,  C08L2205/035

Abstract: The present invention provides an epoxy resin composition comprising at least the following component [A], component [B] and component [C], the epoxy resin composition being characterized in that: the mixture of component [A] and component [B] is a mixture that, when temperature is increased at 2° C./min, begins to thicken at temperature (T1) and completes thickening at temperature (T2), temperature (T1) being 80-110° C. and temperature (T1) and temperature (T2) satisfying the relationship of expression (1) 5° C.≤(T2−T1)≤20° C. expression (1); and the mixture of component [A] and component [C] is a mixture that, when temperature is increased at 2° C./min, begins to cure at temperature (T3), temperature (T1) and temperature (T3) satisfying the relationship of expression (2) 5° C.≤(T3−T1)≤80° C. expression (2). Component [A]: epoxy resin Component [B]: thickening particle Component [C]: curing agent

公开(公告)号：US20160280871A1

公开(公告)日：2016-09-29

申请号：US15037358

申请日：2014-11-21

Applicant: TOHO TENAX CO., LTD.

Inventor： Toru KANEKO

IPC: C08J5/24 ,  C08L63/00 ,  C08J5/04 ,  B29C65/02 ,  B29C70/34 ,  B29C70/12 ,  B29C70/44 ,  C08L63/04 ,  C08L31/02

CPC classification number: C08J5/24 ,  B29C65/02 ,  B29C70/12 ,  B29C70/342 ,  B29C70/44 ,  B29K2663/00 ,  C08G59/4021 ,  C08J5/042 ,  C08J2331/02 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/04 ,  C08J2431/02 ,  C08J2433/00 ,  C08J2433/06 ,  C08J2463/02 ,  C08L31/02 ,  C08L33/06 ,  C08L33/12 ,  C08L63/00 ,  C08L63/04 ,  C08L101/00 ,  C08L2205/02 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L33/10

Abstract: The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150° C.) after having been held at a temperature of 150° C. for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120° C., the lowest viscosity (R) is 0.1-10 Pa·s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1): 5

Abstract translation: 本发明提供一种热固性树脂组合物，其包含（1）包含热固性树脂（a）和增稠剂颗粒（b）的热固性树脂混合物，并且在保持后具有粘度（150℃） 在粘度（S）为150℃，30秒的温度下，和（2）固化剂，其特征在于，所述热固性树脂组合物在80-120℃下显示出最低的粘度（R） ，最低粘度（R）为0.1-10Pa·s，粘度（S）和最低粘度（R）满足式（1）的关系：5