公开(公告)号：US10647849B2

公开(公告)日：2020-05-12

申请号：US15562544

申请日：2016-03-30

Applicant: TOHO TENAX CO., LTD.

Inventor： Toru Kaneko ,  Yuko Okano

IPC: C08J5/24 ,  B32B3/12 ,  B32B5/24 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08L63/00 ,  C08L33/10 ,  C08L101/00 ,  C08G59/40 ,  B29C43/02 ,  C08K5/21 ,  C08K5/315 ,  B29C43/12 ,  B32B37/10 ,  B29C70/34 ,  B29K105/08 ,  B29K307/04 ,  B29K663/00 ,  B29L9/00

Abstract: The present invention provides an epoxy resin composition comprising at least the following component [A], component [B] and component [C], the epoxy resin composition being characterized in that: the mixture of component [A] and component [B] is a mixture that, when temperature is increased at 2° C./min, begins to thicken at temperature (T1) and completes thickening at temperature (T2), temperature (T1) being 80-110° C. and temperature (T1) and temperature (T2) satisfying the relationship of expression (1) 5° C.≤(T2−T1)≤20° C. expression (1); and the mixture of component [A] and component [C] is a mixture that, when temperature is increased at 2° C./min, begins to cure at temperature (T3), temperature (T1) and temperature (T3) satisfying the relationship of expression (2) 5° C.≤(T3−T1)≤80° C. expression (2). Component [A]: epoxy resin Component [B]: thickening particle Component [C]: curing agent.