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公开(公告)号:US20250006533A1
公开(公告)日:2025-01-02
申请号:US18697729
申请日:2021-10-13
Applicant: TOKYO ELECTRON LIMITED
Inventor: Wataru MATSUMOTO , Takehiro SHINDO , Tatsuru OKAMURA , Nanako SHINODA , Junpei SASAKI
IPC: H01L21/677 , H01L21/67 , H01L21/68
Abstract: This substrate conveyance method is disclosed for a conveyance device. A conveyance chamber includes a conveyance mechanism having forks, on upper and lower sides, and support a substrate. A buffer chamber is connected to the conveyance chamber, and includes: a mounting unit that mounts a substrate; and, pins that support the substrate. In the method, the conveyance mechanism, with a second substrate supported by the lower fork, is inserted into the buffer chamber in which a first substrate is mounted on the mounting unit, and the first substrate is lifted by the upper fork. In the method, the pins are raised while the first substrate is lifted by the upper fork, and the second substrate supported by the lower fork is lifted by the pins. In the method, the conveyance mechanism is removed from the buffer chamber while the second substrate is lifted by the pins.
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公开(公告)号:US20190198369A1
公开(公告)日:2019-06-27
申请号:US16224952
申请日:2018-12-19
Applicant: TOKYO ELECTRON LIMITED
Inventor: Hiromitsu SAKAUE , Junpei SASAKI
IPC: H01L21/677 , B25J18/04 , B25J9/10
CPC classification number: H01L21/67742 , B25J9/107 , B25J18/04 , H01L21/67748 , H01L21/6776
Abstract: A substrate processing apparatus, includes: a substrate transfer mechanism configured to advance and retreat a holding body that holds a substrate by symmetrically arranging two link mechanisms each including a driving arm and a driven arm; a processing module; a rotation angle measuring part configured to measure a rotation angle the driving arms; a holding body detection part configured to detect that a specific portion of the holding body is located at a predetermined position; and a controller configured to execute a step of acquiring a measurement value of the rotation angle of the driving arm, a step of obtaining a moving average of the measurement value of the rotation angle, and a step of obtaining a correction amount of the rotation angle so that a substrate transfer position of the holding body of the substrate transfer mechanism for the processing module becomes a reference position.
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