公开(公告)号：US20210249240A1

公开(公告)日：2021-08-12

申请号：US16972784

申请日：2019-05-30

Applicant: TOKYO ELECTRON LIMITED

Inventor： Satoshi ITOH ,  Takafumi NOGAMI ,  Eita YOKOKURA ,  Reisa MATSUMOTO

IPC: H01J37/32 ,  B08B7/00 ,  C23C16/44 ,  C23C16/511

Abstract: Provided is a method for cleaning a microwave plasma processing apparatus which has a processing container and a microwave radiation part, and which has a window part provided at a position where the microwave radiation part is disposed in the processing container. The method includes a cleaning step of adjusting a pressure to a pressure corresponding to a size of a cleaning target part, among parts within the processing container including a wall surface of the processing container, the microwave radiation part, and the window part, while supplying a cleaning gas, and performing a cleaning process using plasma of the cleaning gas.