公开(公告)号：US20180182610A1

公开(公告)日：2018-06-28

申请号：US15904539

申请日：2018-02-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Miyako KANEKO ,  Keiji TANOUCHI ,  Takehiko ORll ,  ltaru KANNO ,  Meitoku AlBARA ,  Satoru TANAKA

IPC: H01L21/02 ,  H01L21/67

Abstract: A method for cleaning a substrate includes supplying to a substrate a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the substrate, supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate, and supplying to the processing film formed on the substrate a dissolving-processing liquid which dissolves the processing film after the supplying of the strip-processing liquid.