公开(公告)号：US20190013225A1

公开(公告)日：2019-01-10

申请号：US16026395

申请日：2018-07-03

Applicant: TOKYO ELECTRON LIMITED

Inventor： Junnosuke TAGUCHI ,  Yuya SASAKI ,  Toshiya CHIBA

IPC: H01L21/67 ,  H01L21/687 ,  G01N21/95

CPC classification number: H01L21/67288 ,  G01B11/306 ,  G01N21/9505 ,  H01L21/68764 ,  H01L21/68771

Abstract: A substrate warpage detection device for detecting warpage of a substrate loaded on a substrate loading region having a recess shape formed on a rotary table along a circumferential direction during rotation of the rotary table, includes a light transmitting part configured to transmit a light beam obliquely upward from a side of the rotary table such that a lower portion of the light beam collides with an upper end of a side surface of the rotary table and an upper portion of the light beam positioned more upward than the lower portion of the light beam passes a portion near the surface of the rotary table, and a light receiving part installed to face the light transmitting part and configured to receive the light beam passing the portion near the surface of the rotary table so as to detect an amount of received light.

公开(公告)号：US20190013224A1

公开(公告)日：2019-01-10

申请号：US16025560

申请日：2018-07-02

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toshiya CHIBA ,  Yuya SASAKI ,  Junnosuke TAGUCHI

IPC: H01L21/67 ,  C23C16/52 ,  C23C16/458 ,  H01L21/687 ,  G01B11/16

Abstract: There is provided a substrate warping monitoring device for monitoring a warping of a substrate mounted in a substrate mounting region formed in a rotary table along a circumferential direction during rotation of the rotary table, including: an optical displacement meter located above the rotary table and configured to irradiate a light to a predetermined position on the rotary table, receive a reflected light reflected off the rotary table and the substrate which passes through the predetermined position and measure a surface profile of the substrate; a memory part configured to store a measurement value acquired when the light is irradiated on a predetermined reference surface, as a reference value; and a calculation part configured to calculate a warping amount of the substrate based on the surface profile of the substrate measured by the optical displacement meter and the reference value stored in the memory part.