PLASMA PROCESSING APPARATUS AND PLASMA CONTROL METHOD

    公开(公告)号:US20180350566A1

    公开(公告)日:2018-12-06

    申请号:US15997776

    申请日:2018-06-05

    Abstract: A plasma processing apparatus includes a mounting table, a power supply unit and a power supply control unit. The mounting table has therein a coil provided along a mounting surface on which a focus ring is mounted. The power supply unit is configured to apply a high frequency voltage to the coil. The power supply control unit is configured to control the power supply unit to increase a power of the high frequency voltage applied to the coil in accordance with consumption of the focus ring.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE REMOVING METHOD

    公开(公告)号:US20180308738A1

    公开(公告)日:2018-10-25

    申请号:US15959423

    申请日:2018-04-23

    Inventor: Yasuhiro TOBE

    Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes: an electro-static chuck configured to retain a substrate on a platform by electrostatic attraction; an ionized gas generation unit configured to ionize a pressure-controlled gas to generate an ionized gas; a gas supplying path, which is made of insulating material or to whose inner surface insulating processing is applied, configured to allow passage of the generated ionized gas; a gas supplying tube configured to supply the ionized gas that has passed the gas supplying path to a gap between the substrate and the electro-static chuck; and a gas exhaust path, which is provided inside the platform, configured to exhaust the gas that has been supplied to the gap.

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