公开(公告)号：US20160286653A1

公开(公告)日：2016-09-29

申请号：US14778162

申请日：2014-03-27

Applicant: TOPPAN FORMS CO., LTD.

Inventor： Akihito MORI

IPC: H05K1/18 ,  C09J169/00 ,  C09D11/52 ,  H05K3/32 ,  H05K1/09

CPC classification number: H05K1/181 ,  B32B15/00 ,  B32B2457/08 ,  C09D11/52 ,  C09J169/00 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/09 ,  H05K1/092 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1208 ,  H05K3/321 ,  H05K2201/06 ,  H05K2201/10636 ,  H05K2203/1157 ,  H05K2203/121 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.

Abstract translation: 提供一种在基材上具有银层的层叠体，其中，银层包含粗糙度曲线的曲线满足以下条件（i）中的至少一个的表面，即，峰度的变化率为50％以下，高于或等于50％ 240小时后温度为85℃，相对湿度为85％的条件已经过去，条件（ii）在85℃的温度条件下，峰度的变化率大于等于200％ 经过480小时后的相对湿度为85％，并且通过导电接合部分将电子部件安装在层叠体的表面上的电路板。