公开(公告)号：US12101074B2

公开(公告)日：2024-09-24

申请号：US17551385

申请日：2021-12-15

Applicant: TOPPAN INC.

Inventor： Noriko Kanou ,  Susumu Maniwa

IPC: H03H7/01 ,  H05K1/11 ,  H05K1/16

CPC classification number: H03H7/1741 ,  H03H7/0115 ,  H05K1/115 ,  H05K1/16

Abstract: A multilayer circuit board with an LC resonant circuit that has an electronic component package including the multilayer circuit board with the LC resonant circuit are provided. The multilayer circuit board with the LC resonant circuit configured by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate includes a first set of wiring lines, a set of vias, and a second set of wiring lines. The first set of wiring lines configures both ends of the LC resonant circuit and is formed in a first one of the conductive layers. The set of vias extends through the insulating resin layers. The second set of wiring lines is connected to an input/output terminal of the LC resonant circuit and is formed in a second one of the conductive layers. The first set of wiring lines is connected to the second set of wiring lines.