公开(公告)号：US11877394B2

公开(公告)日：2024-01-16

申请号：US17746018

申请日：2022-05-17

Applicant: TOPPAN INC.

Inventor： Susumu Maniwa ,  Masashi Sawadaishi

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/0306 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4661 ,  H05K2201/1003 ,  H05K2201/10015

Abstract: A glass core multilayer wiring board includes a glass substrate, a through electrode, a first layer structure, and a second layer structure. A through hole has a diameter decreasing from a first surface toward a second surface. The through electrode is along a side wall of the through hole. The first layer structure is on the first surface and the second layer structure is on the second surface. The second layer structure closes an opening in the second surface defining a bottom section. The through electrode has: a first layer on part of the side wall and on part or all of the bottom section of the through hole closing the opening of the through hole, a second layer covering the first layer, the side wall of the through hole exposed, and the bottom section, and a third layer is located on the second layer.

公开(公告)号：US12101074B2

公开(公告)日：2024-09-24

申请号：US17551385

申请日：2021-12-15

Applicant: TOPPAN INC.

Inventor： Noriko Kanou ,  Susumu Maniwa

IPC: H03H7/01 ,  H05K1/11 ,  H05K1/16

CPC classification number: H03H7/1741 ,  H03H7/0115 ,  H05K1/115 ,  H05K1/16

Abstract: A multilayer circuit board with an LC resonant circuit that has an electronic component package including the multilayer circuit board with the LC resonant circuit are provided. The multilayer circuit board with the LC resonant circuit configured by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate includes a first set of wiring lines, a set of vias, and a second set of wiring lines. The first set of wiring lines configures both ends of the LC resonant circuit and is formed in a first one of the conductive layers. The set of vias extends through the insulating resin layers. The second set of wiring lines is connected to an input/output terminal of the LC resonant circuit and is formed in a second one of the conductive layers. The first set of wiring lines is connected to the second set of wiring lines.