THIN FILM TRANSISTOR AND METHOD OF MANUFACTRUTING THIN FILM TRANSISTOR

    公开(公告)号:US20230420573A1

    公开(公告)日:2023-12-28

    申请号:US18466013

    申请日:2023-09-13

    Applicant: TOPPAN Inc.

    Abstract: A gate insulating layer of a thin film transistor includes a first gate insulating coating including an organic polymer compound or an organic-inorganic composite material, and a second gate insulating coating including one selected from a group of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide. The second gate insulating coating is sandwiched between the first gate insulating coating and a semiconductor layer. The first gate insulating coating has a thickness of 100 nm or greater and 1500 nm or less, and a product of the thickness and Young's modulus of the first gate insulating coating is 300 nm·GPa or greater and 30000 nm·GPa or less. The second gate insulating coating has a thickness of 2 nm or greater and 30 nm or less, and a product of the thickness and Young's modulus of the second gate insulating coating is 100 nm·GPa or greater and 9000 nm·GPa or less.

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