公开(公告)号：US20240165609A1

公开(公告)日：2024-05-23

申请号：US18425328

申请日：2024-01-29

Applicant: TOPPAN Inc.

Inventor： Hidemitsu HAKII ,  Norihito FUKUGAMI

IPC: B01L3/00

CPC classification number: B01L3/502707 ,  B01L3/502723 ,  B01L2200/12 ,  B01L2300/048 ,  B01L2300/123 ,  B01L2300/161

Abstract: A microfluidic chip includes a substrate, a partition layer including a resin material and provided on the substrate to form a channel, and a cover layer provided on the surface of the partition layer facing away from the substrate, where the partition layer has an elastic modulus in the range of 1 MPa or more and 10 GPa or less.