公开(公告)号：US20130112652A1

公开(公告)日：2013-05-09

申请号：US13665350

申请日：2012-10-31

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Junko TODA ,  Susumu Maniwa ,  Takehito Tsukamoto

IPC: H01L23/00

CPC classification number: H01L24/27 ,  H01L21/4828 ,  H01L23/3121 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2924/20756 ,  H01L2924/00015 ,  H01L2924/20753

Abstract: A manufacturing method of a semiconductor element substrate including: forming a first photoresist pattern on a first surface of a metallic plate, to form a semiconductor element mounting part, a semiconductor element electrode connection terminal, a wiring, an outer frame part, and a slit; forming a second photoresist pattern on the second surface of the metallic plate; forming the slit by half etching to connect the metallic chip with a four corners of the outer frame part; forming a plurality of concaved parts on the second surface of the metallic plate; forming a resin layer by injecting a resin to the plurality of concaved parts; and etching the first surface of the metallic plate and forming the semiconductor element electrode connection terminal and the outer frame.

Abstract translation: 一种半导体元件基板的制造方法，包括：在金属板的第一面上形成第一光致抗蚀剂图案，形成半导体元件安装部，半导体元件电极连接端子，布线，外框部，狭缝 ; 在所述金属板的第二表面上形成第二光致抗蚀剂图案; 通过半蚀刻形成狭缝，以将金属芯片与外框架部分的四个角部连接; 在金属板的第二表面上形成多个凹部; 通过向所述多个凹部注入树脂来形成树脂层; 并且蚀刻金属板的第一表面并形成半导体元件电极连接端子和外框架。