公开(公告)号：US11948859B2

公开(公告)日：2024-04-02

申请号：US17424695

申请日：2019-12-05

申请人： TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION

发明人： Takayuki Furuya ,  Akira Kagami

IPC分类号： H01L23/473 ,  H01L23/492 ,  H01L25/07

CPC分类号： H01L23/473 ,  H01L23/4922 ,  H01L25/071

摘要： An element module includes a cooler, a plurality of elements, and a conductive member. The cooler includes a first element disposition portion and a second element disposition portion which are provided on both sides in a predetermined direction. The plurality of elements are disposed in each of the first element disposition portion and the second element disposition portion. The conductive member is disposed in a space portion of the cooler. The space portion penetrates the cooler between the plurality of elements in each of the first element disposition portion and the second element disposition portion. The space portion allows the first element disposition portion and the second element disposition portion to communicate with each other. The conductive member is connected to the element of the first element disposition portion and the element of the second element disposition portion.