公开(公告)号：US20170178944A1

公开(公告)日：2017-06-22

申请号：US15452330

申请日：2017-03-07

Applicant: TOTO LTD.

Inventor： Kosuke YAMAGUCHI ,  Kazuki ANADA ,  Tatsuya KOGA ,  Hiroki MATSUI

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/6831 ,  H01L21/68757 ,  H01L2221/683 ,  H02N13/00 ,  Y10T279/23 ,  Y10T279/33

Abstract: An electrostatic chuck includes: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material. The bonding layer has a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than a second area of the end face which is different from the first area.

公开(公告)号：US20150279714A1

公开(公告)日：2015-10-01

申请号：US14663526

申请日：2015-03-20

Applicant: TOTO LTD.

Inventor： Kosuke YAMAGUCHI ,  Kazuki ANADA ,  Tatsuya KOGA ,  Hiroki MATSUI

IPC: H01L21/683 ,  H02N13/00

CPC classification number: H01L21/6833 ,  H01L21/6831 ,  H01L21/68757 ,  H01L2221/683 ,  H02N13/00 ,  Y10T279/23 ,  Y10T279/33

Abstract: According to an aspect of the invention, there is provided an electrostatic chuck including: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material, the bonding layer having a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than another second area of the end face which is different from the first area.

Abstract translation: 根据本发明的一个方面，提供了一种静电卡盘，其包括：具有第一主表面，第二主表面和通孔的陶瓷电介质基板; 金属基板，其具有与通孔连通的气体导入路径; 以及接合层，其设置在所述陶瓷电介质基板和所述基板之间并且包括树脂材料，所述接合层具有设置在所述第二主表面中的通孔的开口和所述气体引入路径之间的空间， 大于所述开口部的水平方向，并且所述接合层的与所述第二主面相交的端面的端面比所述端面的另一第二区域从所述开口凹进的第一区域， 与第一个区域不同。