公开(公告)号：US09905449B2

公开(公告)日：2018-02-27

申请号：US15452330

申请日：2017-03-07

Applicant: TOTO LTD.

Inventor： Kosuke Yamaguchi ,  Kazuki Anada ,  Tatsuya Koga ,  Hiroki Matsui

IPC: H01L21/683 ,  H02N13/00 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/6831 ,  H01L21/68757 ,  H01L2221/683 ,  H02N13/00 ,  Y10T279/23 ,  Y10T279/33

Abstract: An electrostatic chuck includes: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material. The bonding layer has a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than a second area of the end face which is different from the first area.

公开(公告)号：US09627240B2

公开(公告)日：2017-04-18

申请号：US14663526

申请日：2015-03-20

Applicant: TOTO LTD.

Inventor： Kosuke Yamaguchi ,  Kazuki Anada ,  Tatsuya Koga ,  Hiroki Matsui

IPC: H01L21/683 ,  H02N13/00 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/6831 ,  H01L21/68757 ,  H01L2221/683 ,  H02N13/00 ,  Y10T279/23 ,  Y10T279/33

Abstract: According to an aspect of the invention, there is provided an electrostatic chuck including: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material, the bonding layer having a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than another second area of the end face which is different from the first area.