公开(公告)号：US11749507B2

公开(公告)日：2023-09-05

申请号：US17701855

申请日：2022-03-23

Applicant: TOTO LTD.

Inventor： Ryunosuke Nakagawa ,  Tatsuya Koga

IPC: H01J37/32

CPC classification number: H01J37/3244 ,  H01J37/3288 ,  H01J2237/334 ,  H01J2237/3321

Abstract: According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a base material and a ceramic layer. The base material includes a first surface, a second surface, and at least one hole. The at least one hole extends through the first and second surfaces. The ceramic layer is located on the first surface. The at least one hole includes an oblique surface and a perpendicular surface. The oblique surface is continuous with the first surface and is oblique to a first direction from the first surface toward the second surface. The perpendicular surface is positioned between the second surface and the oblique surface in the first direction and extends along the first direction. An angle between the first surface and the oblique surface is greater than an angle between the perpendicular surface and the oblique surface.

公开(公告)号：US09905449B2

公开(公告)日：2018-02-27

申请号：US15452330

申请日：2017-03-07

Applicant: TOTO LTD.

Inventor： Kosuke Yamaguchi ,  Kazuki Anada ,  Tatsuya Koga ,  Hiroki Matsui

IPC: H01L21/683 ,  H02N13/00 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/6831 ,  H01L21/68757 ,  H01L2221/683 ,  H02N13/00 ,  Y10T279/23 ,  Y10T279/33

Abstract: An electrostatic chuck includes: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material. The bonding layer has a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than a second area of the end face which is different from the first area.

公开(公告)号：US09627240B2

公开(公告)日：2017-04-18

申请号：US14663526

申请日：2015-03-20

Applicant: TOTO LTD.

Inventor： Kosuke Yamaguchi ,  Kazuki Anada ,  Tatsuya Koga ,  Hiroki Matsui

IPC: H01L21/683 ,  H02N13/00 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/6831 ,  H01L21/68757 ,  H01L2221/683 ,  H02N13/00 ,  Y10T279/23 ,  Y10T279/33

Abstract: According to an aspect of the invention, there is provided an electrostatic chuck including: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material, the bonding layer having a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than another second area of the end face which is different from the first area.