公开(公告)号：US10923383B2

公开(公告)日：2021-02-16

申请号：US16352904

申请日：2019-03-14

申请人： TOTO LTD.

发明人： Takara Katayama ,  Kosuke Yamaguchi ,  Ikuo Itakura ,  Yutaka Momiyama ,  Jun Shiraishi ,  Shuichiro Saigan

IPC分类号： H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H02N13/00

摘要： According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface of the ceramic dielectric substrate and being opposite to the gas introduction path. The first porous part includes a first region positioned on the ceramic dielectric substrate side. The ceramic dielectric substrate includes a first substrate region positioned on the first region side. The first region and the first substrate region are provided in contact with each other, and an average particle diameter in the first region is different from an average particle diameter in the first substrate region.

公开(公告)号：US11380574B2

公开(公告)日：2022-07-05

申请号：US17179994

申请日：2021-02-19

申请人： TOTO LTD.

发明人： Masaki Sato ,  Ikuo Itakura ,  Shuichiro Saigan ,  Jun Shiraishi ,  Yutaka Momiyama ,  Kouta Kobayashi

IPC分类号： H01L21/683

摘要： An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.

公开(公告)号：US11018039B2

公开(公告)日：2021-05-25

申请号：US16352899

申请日：2019-03-14

申请人： TOTO LTD.

发明人： Kosuke Yamaguchi ,  Jun Shiraishi ,  Ikuo Itakura ,  Yutaka Momiyama ,  Shuichiro Saigan

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01L21/687

摘要： According to the embodiment, the electrostatic chuck includes a ceramic dielectric substrate having a first major surface and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. At least one of the ceramic dielectric substrate or the first porous part includes a second hole part positioned between the first hole part and the first porous part, and a dimension of the second hole part is smaller than a dimension of the first porous part and larger than a dimension of the first hole part.

公开(公告)号：US11410868B2

公开(公告)日：2022-08-09

申请号：US17179994

申请日：2021-02-19

申请人： TOTO LTD.

发明人： Masaki Sato ,  Ikuo Itakura ,  Shuichiro Saigan ,  Jun Shiraishi ,  Yutaka Momiyama ,  Kouta Kobayashi

IPC分类号： H01L21/683

摘要： An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.