Electrostatic chuck and processing apparatus

    公开(公告)号:US11417556B2

    公开(公告)日:2022-08-16

    申请号:US16810482

    申请日:2020-03-05

    Applicant: TOTO LTD.

    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second porous parts. The ceramic dielectric substrate includes first and second major surfaces. The second major surface is opposite to the first major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided in the ceramic dielectric substrate and is opposite to the gas feed channel. The second porous part is provided in the base plate and is opposite to the gas feed channel. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. The first porous part includes a first porous region including pores and a first dense region. The second porous part includes a second porous region including pores and a second dense region.

    Electrostatic chuck
    2.
    发明授权

    公开(公告)号:US10923383B2

    公开(公告)日:2021-02-16

    申请号:US16352904

    申请日:2019-03-14

    Applicant: TOTO LTD.

    Abstract: According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface of the ceramic dielectric substrate and being opposite to the gas introduction path. The first porous part includes a first region positioned on the ceramic dielectric substrate side. The ceramic dielectric substrate includes a first substrate region positioned on the first region side. The first region and the first substrate region are provided in contact with each other, and an average particle diameter in the first region is different from an average particle diameter in the first substrate region.

    Electrostatic chuck
    3.
    发明授权

    公开(公告)号:US12014947B2

    公开(公告)日:2024-06-18

    申请号:US17690337

    申请日:2022-03-09

    Applicant: TOTO LTD.

    CPC classification number: H01L21/6833

    Abstract: An electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first porous part. The ceramic dielectric substrate has a first major surface and a second major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided between the base plate and the first major surface. The ceramic dielectric substrate includes a first hole part. The first porous part includes a porous section, and a first compact section being more compact than the porous section. The porous section including a plurality of sparse portions including a plurality of pores including a first pore and a second pore, and a dense portion having a higher density than the sparse portion.

    Electrostatic chuck
    4.
    发明授权

    公开(公告)号:US11626310B2

    公开(公告)日:2023-04-11

    申请号:US16576289

    申请日:2019-09-19

    Applicant: TOTO LTD.

    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first porous part. The ceramic dielectric substrate has a first major surface and a second major surface on opposite side from the first major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided at a position between the base plate and the first major surface of the ceramic dielectric substrate. The position is opposed to the gas feed channel. The first porous part includes a plurality of sparse portions each including a plurality of pores. The plurality of sparse portions are spaced from each other. Each of the plurality of sparse portions extends in a direction inclined by a prescribed angle with respect to a first direction from the base plate to the ceramic dielectric substrate.

    Electrostatic chuck
    5.
    发明授权

    公开(公告)号:US11380574B2

    公开(公告)日:2022-07-05

    申请号:US17179994

    申请日:2021-02-19

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.

    Electrostatic chuck
    6.
    发明授权

    公开(公告)号:US11309204B2

    公开(公告)日:2022-04-19

    申请号:US16576220

    申请日:2019-09-19

    Applicant: TOTO LTD.

    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first porous part. The ceramic dielectric substrate has a first major surface and a second major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided between the base plate and the first major surface. The ceramic dielectric substrate includes a first hole part. The first porous part includes a porous section, and a first compact section being more compact than the porous section. As projected on a plane perpendicular to a first direction from the base plate to the ceramic dielectric substrate, the first compact section is configured to overlap the first hole part, and the porous section is configured not to overlap the first hole part.

    Electrostatic chuck
    7.
    发明授权

    公开(公告)号:US11145532B2

    公开(公告)日:2021-10-12

    申请号:US16722789

    申请日:2019-12-20

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole is connected to at least one of multiple first grooves. At least one second groove are provided in the first region. The multiple first grooves have substantially circular planar configurations and are provided concentrically. The second groove is connected to at least two of the first grooves. When projected onto a plane perpendicular to a first direction from the base plate toward the ceramic dielectric substrate, at least a portion of the first gas introduction hole overlaps at least one of the first groove or the second groove at a portion where the first groove and the second groove are connected.

    Electrostatic chuck which reduces arc discharge

    公开(公告)号:US11018039B2

    公开(公告)日:2021-05-25

    申请号:US16352899

    申请日:2019-03-14

    Applicant: TOTO LTD.

    Abstract: According to the embodiment, the electrostatic chuck includes a ceramic dielectric substrate having a first major surface and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. At least one of the ceramic dielectric substrate or the first porous part includes a second hole part positioned between the first hole part and the first porous part, and a dimension of the second hole part is smaller than a dimension of the first porous part and larger than a dimension of the first hole part.

    Electrostatic chuck and processing apparatus

    公开(公告)号:US12198964B2

    公开(公告)日:2025-01-14

    申请号:US16810272

    申请日:2020-03-05

    Applicant: TOTO LTD.

    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first porous part. The ceramic dielectric substrate includes first and second major surfaces. The second major surface is opposite to the first major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided in the ceramic dielectric substrate and is opposite to the gas feed channel. The first porous part includes a first porous region, and a first dense region denser than the first porous region. The first porous region includes first sparse portions, and a first dense portion. The first sparse portions include pores. The first dense portion has a higher than the first sparse portions. The first dense portion is positioned between the first sparse portions. The first sparse portions include a first wall part provided between the pores.

    Electrostatic chuck and processing apparatus

    公开(公告)号:US12074014B2

    公开(公告)日:2024-08-27

    申请号:US17897445

    申请日:2022-08-29

    Applicant: TOTO LTD.

    CPC classification number: H01J37/32715 H01J2237/2007

    Abstract: An electrostatic chuck includes a ceramic dielectric substrate, a base plate, a bonding part, a gas inlet path, a counterbore part, and a ceramic porous part. The bonding part is located between the ceramic dielectric substrate and the base plate. The gas inlet path extends through the ceramic dielectric substrate, the base plate, and the bonding part. The gas inlet path includes a first hole part, a second hole part, and a third hole part. The first hole part is positioned at the ceramic dielectric substrate. The second hole part is positioned at the base plate. The third hole part is positioned at the bonding part. The counterbore part is located in at least one of the first hole part or the second hole part. The ceramic porous part is located in the counterbore part. The ceramic porous part includes an exposed surface exposed in the third hole part.

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