MOISTURE-CURABLE ADHESIVE COMPOSITION

    公开(公告)号:US20230090721A1

    公开(公告)日:2023-03-23

    申请号:US17788441

    申请日:2020-12-24

    Abstract: An object of this invention is to provide an adhesive composition that comprises a moisture-curable resin and a modified polyolefin and that achieves an excellent liquid state and excellent adhesion to polyolefin resin substrates. Provided is a moisture-curable adhesive resin composition comprising a moisture-curable resin (A) and a modified polyolefin resin (B), wherein the content of the modified polyolefin resin (B) is 2 parts by mass or more per 100 parts by mass of the moisture-curable resin (A).

Patent Agency Ranking