LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD AND LASER IRRADIATION PROCESSED SURFACE

    公开(公告)号:US20240091880A1

    公开(公告)日:2024-03-21

    申请号:US18522873

    申请日:2023-11-29

    CPC classification number: B23K26/0821

    Abstract: A laser irradiation apparatus irradiates an irradiation object with a laser beam. The apparatus comprises scanning pattern formation sections that change at least either of an emitting direction and a shift amount (size) of a laser beam periodically so that a position irradiated with a laser beam moves periodically along a predetermined scanning pattern on a predetermined plane. And the apparatus comprises an irradiation control section that stops irradiation of a laser beam directed to an excessive irradiation prevention area set in some area in the scanning pattern or makes an intensity of the laser beam lower in comparison with an intensity of a laser beam directed to an area other than the excessive irradiation prevention area.

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