公开(公告)号：US20240217030A1

公开(公告)日：2024-07-04

申请号：US18610573

申请日：2024-03-20

Applicant: TOYOKOH Co.,Ltd.

Inventor： Yoshiaki SUIZU ,  Manabu HARAGUCHI

IPC: B23K26/0622 ,  B23K26/082 ,  B23K26/352 ,  B23K26/36

CPC classification number: B23K26/0622 ,  B23K26/082 ,  B23K26/3576 ,  B23K26/3584 ,  B23K26/36

Abstract: A surface processing method is for removing a surface of a processing object by moving a laser beam spot with respect to the processing surface, where the beam spot is formed by condensing a continuous wave laser beam on an irradiation surface of the processing object. An irradiation time length is 20 μ-second or less when the beam spot passes through one point on the irradiation surface. A relative speed of the beam spot to the irradiation surface is 3 m/s or more.