-
公开(公告)号：US20170154837A1
公开(公告)日：2017-06-01
申请号：US15361151
申请日：2016-11-25
发明人： Tomo SASAKI , Akio KITAMI , Tadafumi YOSHIDA , Masataka DEGUCHI , Kazunori UCHIYAMA , Naoki HAKAMADA
IPC分类号： H01L23/373 , H01L23/473 , H01L23/42
CPC分类号： H01L23/3736 , H01L23/4012 , H01L23/42 , H01L23/473 , H01L25/117 , H01L2224/40245 , H01L2924/181 , H01L2924/00012
摘要： A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.
-
2.发明申请公开(公告)号：US20190302089A1
公开(公告)日：2019-10-03
申请号：US16284512
申请日：2019-02-25
IPC分类号： G01N33/28
摘要： In a method for predicting deterioration of grease, the grease is applied between a semiconductor module and a cooler. The semiconductor module accommodates a semiconductor element. The method for predicting deterioration includes predicting deterioration of the grease after specified heat cycles by using: a variable G1/G2 that is acquired by dividing an initial storage modulus G1 of the grease by an initial loss modulus G2 of the grease at an expected maximum use temperature of the semiconductor element; and distortion dD of the grease at the time when the initial storage modulus G1 and the initial loss modulus G2 have the same value.
-
搜索结果
2 条记录 (耗时 0.012 秒)
