VEHICLE, VEHICLE PLATFORM, VEHICLE CONTROL INTERFACE BOX, AUTONOMOUS DRIVING KIT, CONTROL METHOD OF VEHICLE, AND CONTROL METHOD OF VEHICLE PLATFORM

    公开(公告)号:US20230130452A1

    公开(公告)日:2023-04-27

    申请号:US17890437

    申请日:2022-08-18

    发明人: Tomo SASAKI

    IPC分类号: B60W60/00

    摘要: The VCIB includes a memory, a communication unit, and a processor. The memory stores beforehand pieces of execution information that are used to execute processes corresponding respectively to a plurality of APIs included in an API set that is a combination of APIs for requesting the VP to execute a predetermined function and requesting transmission of predetermined information from the VP. The communication unit receives, from the ADK, a request according to an API included in a permitted API set that the ADK is permitted to use beforehand. The processor executes a process corresponding to the request received by the communication unit by using execution information for an API relating to the request that is stored in the memory.

    SEMICONDUCTOR MODULE STRUCTURE
    8.
    发明申请

    公开(公告)号:US20210028154A1

    公开(公告)日:2021-01-28

    申请号:US16924771

    申请日:2020-07-09

    摘要: A semiconductor module structure includes: a semiconductor element portion including a plurality of capacitor elements; two bus bars sandwiching the semiconductor element portion and being electrically connected to the semiconductor element portion; and cooling fins, which are conductive, formed on respective surfaces of the bus bars at positions sandwiching the semiconductor element portion. Further, insulating refrigerant is provided in the cooling fins.

    METHOD FOR PREDICTING DETERIORATION OF GREASE, GREASE, AND METHOD FOR MANUFACTURING GREASE

    公开(公告)号:US20190302089A1

    公开(公告)日:2019-10-03

    申请号:US16284512

    申请日:2019-02-25

    IPC分类号: G01N33/28

    摘要: In a method for predicting deterioration of grease, the grease is applied between a semiconductor module and a cooler. The semiconductor module accommodates a semiconductor element. The method for predicting deterioration includes predicting deterioration of the grease after specified heat cycles by using: a variable G1/G2 that is acquired by dividing an initial storage modulus G1 of the grease by an initial loss modulus G2 of the grease at an expected maximum use temperature of the semiconductor element; and distortion dD of the grease at the time when the initial storage modulus G1 and the initial loss modulus G2 have the same value.