FILM FORMATION DEVICE FOR METAL FILM
    1.
    发明公开

    公开(公告)号:US20240200221A1

    公开(公告)日:2024-06-20

    申请号:US18482323

    申请日:2023-10-06

    IPC分类号: C25D17/00

    CPC分类号: C25D17/002

    摘要: The film formation device includes an anode made of an insoluble porous body, an electrolyte membrane disposed between a substrate serving as an anode and a cathode, and a housing provided with an accommodation chamber for storing a plating solution containing metal ions between the anode and the electrolyte membrane. The film formation device further includes a diaphragm that covers a cathode side of the anode and is attached so as to be in contact with the cathode side of the anode. The diaphragm is permeable to water and hydrogen ions and impermeable to oxygen gas. The anode is attached so as to close the opening on the side opposite to the cathode side of the accommodation housing so that the cathode side is exposed to the accommodation chamber via the diaphragm and the side opposite to the cathode side is exposed to the outside of the accommodation housing.