Lens module with enhanced stability

    公开(公告)号:US10567625B2

    公开(公告)日:2020-02-18

    申请号:US16116102

    申请日:2018-08-29

    摘要: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket is connected to the surface of the circuit board which has the image sensor. The optical filter is connected to mounting bracket and positioned above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board through a frame of adhesive. The surface of the lens unit connected to the mounting bracket has protrusions which are positioned at inner edges of the adhesive layer. The protrusions are taller than the depth of the adhesive layer.

    Lens module and electronic device having the same including heat dissipation plates

    公开(公告)号:US11366282B2

    公开(公告)日:2022-06-21

    申请号:US16903155

    申请日:2020-06-16

    IPC分类号: G02B7/02

    摘要: A lens module includes a lens holder, a filter, and a metal support. The lens holder includes a groove and sidewalls surrounding to form the groove. The metal support includes a support plate, heat dissipation plates, and heat transfer plates. At least one first mounting hole is formed on the sidewalls. The support plate comprises a support portion and a connecting portion connecting to each other. The connecting portion connects the support portion and each of the heat transfer plates. An opening is formed on the support portion and passes through the support portion. The filter is located on the support portion and covers the opening. The heat transfer plates are installed in the at least one first mounting hole. The support plate is received in the groove. The heat dissipation plates are located outside the lens holder. The disclosure also provides an electronic device having the lens module.

    Lens module
    5.
    发明授权

    公开(公告)号:US10748946B2

    公开(公告)日:2020-08-18

    申请号:US16222012

    申请日:2018-12-17

    摘要: A lens module includes a circuit board, a hollow mounting bracket, a photosensitive chip, a lens base, and a lens. The photosensitive chip is mounted within the hollow mounting bracket on a surface of the circuit board. The lens base is mounted on a surface of the mounting bracket opposite to the circuit board. The lens base axially defines a through hole. The lens is mounted within the lens base. The lens base includes a screw thread formed along an inner wall of the through hole. The lens includes mating threads formed along a periphery of the lens contacting the inner wall of the through hole. The mating threads define at least one thread slot which defines a gap with the screw threads of the inner wall of the through hole.