公开(公告)号：US20220321750A1

公开(公告)日：2022-10-06

申请号：US17512892

申请日：2021-10-28

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： CHIA-WENG HSU

IPC: H04N5/225 ,  G03B17/55

Abstract: A circuit board includes a circuit substrate, a first solder mask, and a plurality of heat dissipation fins. The circuit substrate includes a first surface. The first solder mask is arranged on the first surface. The plurality of heat dissipation fins are arranged on a surface of the first solder mask facing away from the first surface. A heat dissipation channel is formed between any two adjacent of the plurality of heat dissipation fins. A camera assembly having the circuit board and an electronic device having the circuit board are also provided.

公开(公告)号：US20230171478A1

公开(公告)日：2023-06-01

申请号：US17577776

申请日：2022-01-18

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： YE-QUANG CHEN ,  CHIA-WENG HSU ,  WEN-CHING LAI ,  WAN-LI ZHANG

IPC: H04N5/225 ,  H05K1/18

CPC classification number: H04N5/2257 ,  H05K1/183 ,  H04M1/0264

Abstract: An electronic device includes a camera module comprising a circuit board, a lens, a first IC chip, and at least one metal column. The lens is mounted on the circuit board. The first IC chip and the metal column are arranged on a surface of the circuit board away from the lens. An attachment includes a body and a second IC chip. The first IC chip and the second IC chip can communicate with each other. The circuit board includes a first surface closed to the attachment. The metal column is arranged on the first surface, and the body includes a second surface close to the camera module. The body further includes at least a connecting channel. The metal column is located in the connecting channel to realize the electrical connection between the camera module and the attachment.

公开(公告)号：US20230413426A1

公开(公告)日：2023-12-21

申请号：US17883861

申请日：2022-08-09

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： YING-LIN CHEN ,  CHIA-WENG HSU ,  PING-LIANG ENG ,  FENG-CHANG CHIEN

IPC: H05K1/02 ,  G02B5/00 ,  H05K1/18 ,  G03B30/00 ,  H04N5/225

CPC classification number: H05K1/0274 ,  G02B5/003 ,  H05K1/0298 ,  H05K1/183 ,  G03B11/00 ,  G03B30/00 ,  H04N5/2254 ,  H05K2201/10151 ,  H05K1/0277

Abstract: A circuit board assembly in a camera module for blocking unwanted light when images are captured includes a circuit board, a sensor, and an optical blocking body connecting the circuit board and the sensor. The circuit board includes a base board and a photomask. The photomask is arranged on a surface of the base board, the base board includes conductive circuit layers and dielectric layers, the conductive circuit layers and the dielectric layers are alternately arranged, the sensor being electronically connected to the conductive layers. The optical blocking body, the photomask, and the dielectric layers block ambient light entering the camera module other than through the lens assembly of the camera module.