公开(公告)号：US20230060674A1

公开(公告)日：2023-03-02

申请号：US17835880

申请日：2022-06-08

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： WEN-CHING LAI ,  CHAO-YU QIN ,  ZHI-WEI LI

IPC: H04N5/225 ,  G02B26/08 ,  G02B13/00

Abstract: A dual-lens camera system includes a first lens, a second lens, an image sensor corresponding to a position of the first lens, and a reflecting assembly. The reflecting assembly includes a first reflecting member and a second reflecting member corresponding to a position of the second lens. The first reflecting member is movable between a first position at which an optical path from the first lens to the image sensor is blocked but an optical path from the second reflecting member to the image sensor is not blocked, and a second position at which the optical path from the first lens to the image sensor is not blocked but the optical path from the second reflective member to the image sensor is blocked. Only one image sensor is used in the dual-lens camera system, which saves cost and takes up less internal space of the electronic device.

公开(公告)号：US20240107147A1

公开(公告)日：2024-03-28

申请号：US18071421

申请日：2022-11-29

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： HAI-XIN JIN ,  ZHI-WEI LI

IPC: H04N23/57 ,  G02B7/02 ,  H04N23/54 ,  H04N23/55 ,  H05K1/02

CPC classification number: H04N23/57 ,  G02B7/028 ,  H04N23/54 ,  H04N23/55 ,  H05K1/0274

Abstract: A camera module compensating for loss of focus caused by heat-deformation of a lens assembly above a photosensitive element includes the lens assembly, the photosensitive element, a circuit board, and a focusing assembly. The photosensitive element receives light through the lens assembly. The focusing assembly is arranged to apply deformation when temperature changes by moving the photosensitive element away from or toward the lens assembly, so correcting a focal length of the lens assembly on the photosensitive element. An electronic device is also disclosed.

公开(公告)号：US20240074063A1

公开(公告)日：2024-02-29

申请号：US17992595

申请日：2022-11-22

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： WEN-CHING LAI ,  WAN-LI ZHANG ,  ZHI-WEI LI ,  YA-JIE NIU

IPC: H05K1/18 ,  H01L27/146 ,  H05K1/02 ,  H05K3/32

CPC classification number: H05K1/189 ,  H01L27/14625 ,  H05K1/0281 ,  H05K3/32 ,  H01L27/14636 ,  H05K2201/10121

Abstract: A photosensitive assembly includes a circuit board and a photosensitive chip disposed on the circuit board. A first direction is defined as a direction from the circuit board to the photosensitive chip. The circuit board is convex in the first direction or an opposite direction of the first direction. The photosensitive chip is in the first direction or the opposite direction of the first direction. A bending direction of the circuit board is the same as a bending direction of the photosensitive chip.