公开(公告)号：US20240283130A1

公开(公告)日：2024-08-22

申请号：US18317304

申请日：2023-05-15

Applicant: TRON FUTURE TECH INC.

Inventor： KUAN-NENG CHEN ,  HAN-WEN HU ,  YU-JIU WANG ,  LI HAN CHANG

IPC: H01Q1/22 ,  H01Q1/42 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01Q1/422 ,  H01Q9/0407

Abstract: An antenna package is provided. The antenna package includes a glass substrate, a plurality of antennas, a multi-layer circuit structure, and a plurality of radio frequency chips. The glass substrate has a first surface and a second surface. The plurality of antennas are arranged on the first surface of the glass substrate. The multi-layer circuit structure has a first surface and a second surface. The plurality of radio frequency chips are arranged on the first surface of the multi-layer circuit structure. The second surface of the glass substrate is adhered to the second surface of the multi-layer circuit structure.

公开(公告)号：US20230402744A1

公开(公告)日：2023-12-14

申请号：US18066002

申请日：2022-12-14

Applicant: TRON FUTURE TECH INC.

Inventor： KUAN-NENG CHEN ,  HAN-WEN HU ,  YI-CHIEH TSAI ,  YU-JIU WANG ,  LI HAN CHANG

IPC: H01Q1/38 ,  H01Q3/36 ,  H01L25/03

CPC classification number: H01Q1/38 ,  H01Q3/36 ,  H01L25/03 ,  H01L2224/16227 ,  H01L24/16

Abstract: An antenna package structure is provided. The antenna package structure includes a glass substrate, an interconnect structure, a plurality of semiconductor chips, and an antenna array structure. The glass substrate has a first surface and a second surface opposite to the first surface. The interconnect structure is disposed over the first surface of the glass substrate. The plurality of semiconductor chips are mounted over the interconnect structure. The antenna array structure is formed on the second surface of the glass substrate. Furthermore, the plurality of semiconductor chips are coupled to the antenna array structure through the interconnect structure and the glass substrate.