公开(公告)号：US09590338B1

公开(公告)日：2017-03-07

申请号：US14954045

申请日：2015-11-30

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Matthew Ryan Schmitt ,  Linda Ellen Shields ,  Randall R. Henry ,  Sandeep Patel ,  Mailoan Tran

IPC: H01R12/00 ,  H01R12/79

CPC classification number: H01R12/718 ,  H01R12/58 ,  H01R12/714 ,  H01R12/79

Abstract: A rigid-flex circuit connector is provided that includes a layered circuit board and an array of electrical contacts. The layered circuit board has a rigid board stacked above a flex board. The rigid board includes at least one rigid substrate and a rigid board circuit. The rigid board circuit includes a plurality of conductive vias extending into the rigid board from a top surface of the rigid board. The flex board includes at least one flexible substrate and a flex board circuit. The flex board circuit electrically connects to the conductive vias of the rigid board circuit. The array of electrical contacts is loaded in the conductive vias. The electrical contacts have mating ends that protrude from the top surface of the rigid board to mechanically engage and electrically connect to mating contacts of a mating electronic component.

Abstract translation: 提供了一种刚性 - 柔性电路连接器，其包括分层电路板和电触点阵列。 分层电路板具有堆叠在柔性板上方的刚性板。 刚性板包括至少一个刚性基板和刚性板电路。 刚性板电路包括从刚性板的顶表面延伸到刚性板中的多个导电通孔。 柔性板包括至少一个柔性基板和柔性板电路。 柔性板电路电连接到刚性板电路的导电通孔。 电触点阵列装载在导电通孔中。 电触头具有从刚性板的顶表面突出的配合端，以机械地接合并电连接到配合电子部件的配合触点。

公开(公告)号：US08879267B2

公开(公告)日：2014-11-04

申请号：US13648022

申请日：2012-10-09

Applicant: Tyco Electronics Corporation

Inventor： Randall R. Henry ,  Michael E. Shirk

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H04L12/6418

Abstract: A transceiver assembly includes a transceiver module having ribs and a thermal interface member on an outer surface and a receptacle assembly receiving the transceiver module. The receptacle assembly includes a heat sink and a clip coupling the heat sink to a guide frame. The heat sink has a heat sink surface facing the thermal interface member and a step extending from the heat sink surface with a module engagement surface. The ribs ride along the step during insertion into and removal from the receptacle of the transceiver module. When the ribs are longitudinally aligned with and engage the step, the module engagement surface is in an elevated position. When the ribs are longitudinally offset from the step, the module engagement surface is in a recessed position and in direct thermal engagement with the thermal interface member.

Abstract translation: 收发器组件包括在外表面上具有肋和热接口构件的收发器模块，以及接收收发器模块的插座组件。 插座组件包括散热器和将散热器连接到引导框架的夹子。 散热器具有面向热界面构件的散热器表面和从散热器表面与模块接合表面延伸的台阶。 在插入和从收发器模块的插座移除时，肋沿着台阶行进。 当肋条纵向对准并接合台阶时，模块接合表面处于升高位置。 当肋从台阶纵向偏移时，模块接合表面处于凹陷位置并与热界面构件直接热接合。

公开(公告)号：US20140098497A1

公开(公告)日：2014-04-10

申请号：US13648022

申请日：2012-10-09

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Randall R. Henry ,  Michael E. Shirk

IPC: H05K7/20

CPC classification number: H04L12/6418

Abstract: A transceiver assembly includes a transceiver module having ribs and a thermal interface member on an outer surface and a receptacle assembly receiving the transceiver module. The receptacle assembly includes a heat sink and a clip coupling the heat sink to a guide frame. The heat sink has a heat sink surface facing the thermal interface member and a step extending from the heat sink surface with a module engagement surface. The ribs ride along the step during insertion into and removal from the receptacle of the transceiver module. When the ribs are longitudinally aligned with and engage the step, the module engagement surface is in an elevated position. When the ribs are longitudinally offset from the step, the module engagement surface is in a recessed position and in direct thermal engagement with the thermal interface member.

Abstract translation: 收发器组件包括在外表面上具有肋和热接口构件的收发器模块，以及接收收发器模块的插座组件。 插座组件包括散热器和将散热器连接到引导框架的夹子。 散热器具有面向热界面构件的散热器表面和从散热器表面与模块接合表面延伸的台阶。 在插入和从收发器模块的插座移除时，肋沿着台阶行进。 当肋条纵向对准并接合台阶时，模块接合表面处于升高位置。 当肋从台阶纵向偏移时，模块接合表面处于凹陷位置并与热界面构件直接热接合。