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1.发明授权Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same 有权光固化/热固性树脂组合物，由其形成的感光性干膜，以及与其形成图案的方法公开(公告)号：US06844130B2
公开(公告)日：2005-01-18
申请号：US10256009
申请日：2002-09-27
CPC分类号： G03F7/038 , C08G65/18 , G03F7/0045 , H05K3/285 , H05K3/287 , H05K3/4644 , H05K2203/124
摘要： A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.
摘要翻译： 一种光固化性和热固性树脂组合物，其包含（A）在其分子中具有羧基与至少两个烯属不饱和双键组合的光敏预聚物，（B）聚合引发剂，（C）稀释剂，（D）氧杂环丁烷化合物 在其分子中具有至少两个氧杂环丁烷基，和（E）固化促进剂可用碱性溶液显影，并且可以配制成一包装制剂。 这种光固化性和热固性树脂组合物和通过其使用制备的光敏干燥膜可用作各种抗蚀剂材料和电绝缘材料，特别是用于印刷电路板的阻焊剂，用于积聚多层印刷电路板的层间绝缘材料 ，等等。
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2.发明授权Photocurable/therosetting resin composition, photosensitive dry film formed therefrom and method of forming pattern with the same 有权可光固化/固化树脂组合物，由其形成的感光干燥膜和与其形成图案的方法公开(公告)号：US07226710B2
公开(公告)日：2007-06-05
申请号：US10980190
申请日：2004-11-04
IPC分类号： G03F7/038
CPC分类号： G03F7/038 , C08G65/18 , G03F7/0045 , H05K3/285 , H05K3/287 , H05K3/4644 , H05K2203/124
摘要： A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.
摘要翻译： 一种光固化性和热固性树脂组合物，其包含（A）在其分子中具有羧基与至少两个烯属不饱和双键组合的光敏预聚物，（B）聚合引发剂，（C）稀释剂，（D）氧杂环丁烷化合物 在其分子中具有至少两个氧杂环丁烷基，和（E）固化促进剂可用碱性溶液显影，并且可以配制成一包装制剂。 这种光固化性和热固性树脂组合物和通过其使用制备的光敏干燥膜可用作各种抗蚀剂材料和电绝缘材料，特别是用于印刷电路板的阻焊剂，用于积聚多层印刷电路板的层间绝缘材料 ，等等。
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3.发明申请Photocurable/therosetting resin composition, photosensitive dry film formed therefrom and method of forming pattern with the same 有权可光固化/固化树脂组合物，由其形成的感光干燥膜和与其形成图案的方法公开(公告)号：US20050112500A1
公开(公告)日：2005-05-26
申请号：US10980190
申请日：2004-11-04
CPC分类号： G03F7/038 , C08G65/18 , G03F7/0045 , H05K3/285 , H05K3/287 , H05K3/4644 , H05K2203/124
摘要： A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.
摘要翻译： 一种光固化性和热固性树脂组合物，其包含（A）在其分子中具有羧基与至少两个烯属不饱和双键组合的光敏预聚物，（B）聚合引发剂，（C）稀释剂，（D）氧杂环丁烷化合物 在其分子中具有至少两个氧杂环丁烷基，和（E）固化促进剂可用碱性溶液显影，并且可以配制成一包装制剂。 这种光固化性和热固性树脂组合物和通过其使用制备的光敏干燥膜可用作各种抗蚀剂材料和电绝缘材料，特别是用于印刷电路板的阻焊剂，用于积聚多层印刷电路板的层间绝缘材料 ，等等。
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