公开(公告)号：US5545076A

公开(公告)日：1996-08-13

申请号：US440920

申请日：1995-05-15

申请人： Tae-Jin Yun ,  Dong-Pyo Hong ,  Byung-Suk Park

发明人： Tae-Jin Yun ,  Dong-Pyo Hong ,  Byung-Suk Park

IPC分类号： B08B3/02 ,  B24B7/22 ,  H01L21/304 ,  B24B5/00

CPC分类号： B24B37/005 ,  B08B3/02 ,  B24B7/228 ,  Y10S134/902 ,  Y10S438/959

摘要： An apparatus for polish-grinding a semiconductor wafer which assuredly removes contaminant dusts from the polished wafer includes a grinding device for polishing a surface of the wafer. The grinding device has a chuck table on which the wafer is laid, a grinding wheel for grindingly polishing the wafer, and means for supplying water to the wafer. The means for supplying water provides water to region of contact between the grinding wheel and the wafer. The apparatus also includes a cleaning device for cleaning any remaining dust on the wafer, having a spin chuck table for rotating the polished wafer, means for supplying a detergent to the polished wafer. The means for supplying the detergent injects the detergent on the surfaces of the polished wafer. The apparatus also includes a controller for controlling the grinding device and the cleaning device. Accordingly, the apparatus according to the present invention can prevent dust from being suctioned to the front side of a wafer, and can remove dust during and after a wafer-grinding process.

摘要翻译： 一种用于抛光研磨半导体晶片的设备，其可靠地从抛光晶片中去除污染物粉尘包括用于抛光晶片表面的研磨装置。 研磨装置具有夹在其上放置晶片的卡盘台，用于研磨晶片的砂轮，以及向晶片供水的装置。 用于供水的装置为砂轮和晶片之间的接触区域提供水。 该设备还包括清洁装置，用于清洁晶片上剩余的灰尘，具有用于旋转抛光晶片的旋转夹盘，用于向抛光晶片供应洗涤剂的装置。 用于供应洗涤剂的装置将洗涤剂注入抛光晶片的表面上。 该设备还包括用于控制研磨装置和清洁装置的控制器。 因此，根据本发明的装置可以防止灰尘被吸引到晶片的前侧，并且可以在晶片研磨过程中和之后去除灰尘。