公开(公告)号：US10161039B2

公开(公告)日：2018-12-25

申请号：US15876445

申请日：2018-01-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Anthony Lin ,  Ching-Lun Lai ,  Pei-Ren Jeng ,  Tze-Liang Lee

IPC: C23C16/455 ,  C23C16/44 ,  H01L21/02 ,  C23C16/458

Abstract: A semiconductor fabrication apparatus includes a processing chamber, a wafer stage configured in the processing chamber, a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber, and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector both configured to deliver the second chemical to the second reaction zone.

公开(公告)号：US09873943B2

公开(公告)日：2018-01-23

申请号：US15169999

申请日：2016-06-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Anthony Lin ,  Ching-Lun Lai ,  Pei-Ren Jeng ,  Tze-Liang Lee

IPC: C23C16/455 ,  C23C16/44 ,  H01L21/02 ,  C23C16/458

CPC classification number: C23C16/45551 ,  C23C16/4412 ,  C23C16/45519 ,  C23C16/45578 ,  C23C16/4584 ,  H01L21/0228

Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a processing chamber; a wafer stage configured in the processing chamber, the wafer stage is operable to secure and rotate a plurality of wafers around an axis; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector.

公开(公告)号：US20190136378A1

公开(公告)日：2019-05-09

申请号：US16222731

申请日：2018-12-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Anthony Lin ,  Ching-Lun Lai ,  Pei-Ren Jeng ,  Tze-Liang Lee

IPC: C23C16/455 ,  C23C16/458 ,  H01L21/02 ,  C23C16/44

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and air edge mechanisms configured on both sides of the first reaction zone to isolate the first reaction zone from other reaction zones in the processing chamber.

公开(公告)号：US20180142351A1

公开(公告)日：2018-05-24

申请号：US15876445

申请日：2018-01-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Anthony Lin ,  Ching-Lun Lai ,  Pei-Ren Jeng ,  Tze-Liang Lee

IPC: C23C16/455 ,  H01L21/02 ,  C23C16/458 ,  C23C16/44

CPC classification number: C23C16/45551 ,  C23C16/4412 ,  C23C16/45519 ,  C23C16/45578 ,  C23C16/4584 ,  H01L21/0228

Abstract: A semiconductor fabrication apparatus includes a processing chamber, a wafer stage configured in the processing chamber, a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber, and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector both configured to deliver the second chemical to the second reaction zone.

公开(公告)号：US11008654B2

公开(公告)日：2021-05-18

申请号：US16698217

申请日：2019-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Anthony Lin ,  Ching-Lun Lai ,  Pei-Ren Jeng ,  Tze-Liang Lee

IPC: C23C16/44 ,  H01L21/02 ,  C23C16/455 ,  C23C16/458

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; and a chemical delivery mechanism configured in the processing chamber to provide a chemical to a reaction zone in the processing chamber. The chemical delivery mechanism includes an edge chemical injector, a first radial chemical injector, and a second radial chemical injector configured on three sides of the reaction zone.

公开(公告)号：US20200095682A1

公开(公告)日：2020-03-26

申请号：US16698217

申请日：2019-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Anthony Lin ,  Ching-Lun Lai ,  Pei-Ren Jeng ,  Tze-Liang Lee

IPC: C23C16/455 ,  C23C16/44 ,  H01L21/02 ,  C23C16/458

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; and a chemical delivery mechanism configured in the processing chamber to provide a chemical to a reaction zone in the processing chamber. The chemical delivery mechanism includes an edge chemical injector, a first radial chemical injector, and a second radial chemical injector configured on three sides of the reaction zone.

公开(公告)号：US20170167021A1

公开(公告)日：2017-06-15

申请号：US15169999

申请日：2016-06-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Anthony Lin ,  Ching-Lun Lai ,  Pei-Ren Jeng ,  Tze-Liang Lee

IPC: C23C16/455 ,  H01L21/02 ,  C23C16/44

CPC classification number: C23C16/45551 ,  C23C16/4412 ,  C23C16/45519 ,  C23C16/45578 ,  C23C16/4584 ,  H01L21/0228

Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a processing chamber; a wafer stage configured in the processing chamber, the wafer stage is operable to secure and rotate a plurality of wafers around an axis; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector.