公开(公告)号：US20240071947A1

公开(公告)日：2024-02-29

申请号：US17823157

申请日：2022-08-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ling Tsai ,  Lai Wei Chih ,  Meng-Tsan Lee ,  Hung-Pin Chang ,  Li-Han Hsu ,  Chien-Chia Chiu ,  Cheng-Hung Lin

IPC: H01L23/00 ,  H01L23/053 ,  H01L25/18

CPC classification number: H01L23/562 ,  H01L23/053 ,  H01L25/18 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/24225 ,  H01L2224/97

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.