公开(公告)号：US20190189577A1

公开(公告)日：2019-06-20

申请号：US16194927

申请日：2018-11-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Hung CHEN ,  Yu-Nu HSU ,  Chun-Chen LIU ,  Heng-Chi HUANG ,  Chien-Chen LI ,  Shih-Yen CHEN ,  Cheng-Nan HSIEH ,  Kuo-Chio LIU ,  Chen-Shien CHEN ,  Chin-Yu KU ,  Te-Hsun PANG ,  Yuan-Feng WU ,  Sen-Chi CHIANG

IPC: H01L23/00 ,  H01L23/498

Abstract: A package structure is provided. The package structure includes a first bump structure formed over a substrate, a solder joint formed over the first bump structure and a second bump structure formed over the solder joint. The first bump structure includes a first pillar layer formed over the substrate and a first barrier layer formed over the first pillar layer. The first barrier layer has a first protruding portion which extends away from a sidewall surface of the first pillar layer, and a distance between the sidewall surface of the first pillar layer and a sidewall surface of the first barrier layer is in a range from about 0.5 μm to about 3 μm. The second bump structure includes a second barrier layer formed over the solder joint and a second pillar layer formed over the second barrier layer, wherein the second barrier layer has a second protruding portion which extends away from a sidewall surface of the second pillar layer.