公开(公告)号：US20240377826A1

公开(公告)日：2024-11-14

申请号：US18784749

申请日：2024-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Cheng-Hung CHEN ,  Yan-Han CHEN ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: G05D1/00 ,  B25J5/00 ,  G01S17/931

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

公开(公告)号：US20220261001A1

公开(公告)日：2022-08-18

申请号：US17736915

申请日：2022-05-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Cheng-Hung CHEN ,  Yan-Han CHEN ,  Feng-Kuang WU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: G05D1/02 ,  G01S17/931 ,  B25J5/00 ,  G05D1/00

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

公开(公告)号：US20190164793A1

公开(公告)日：2019-05-30

申请号：US16201312

申请日：2018-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO ,  Sheng-Hsiang CHUANG ,  Cheng-Hung CHEN

IPC: H01L21/67 ,  H01L21/687 ,  G05B19/18

Abstract: In an embodiment, a system includes a profiler configured to detect variations along a surface of a semiconductor stage; and a jig configured to move the profiler along an axis over the semiconductor stage.

公开(公告)号：US20190189577A1

公开(公告)日：2019-06-20

申请号：US16194927

申请日：2018-11-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Hung CHEN ,  Yu-Nu HSU ,  Chun-Chen LIU ,  Heng-Chi HUANG ,  Chien-Chen LI ,  Shih-Yen CHEN ,  Cheng-Nan HSIEH ,  Kuo-Chio LIU ,  Chen-Shien CHEN ,  Chin-Yu KU ,  Te-Hsun PANG ,  Yuan-Feng WU ,  Sen-Chi CHIANG

IPC: H01L23/00 ,  H01L23/498

Abstract: A package structure is provided. The package structure includes a first bump structure formed over a substrate, a solder joint formed over the first bump structure and a second bump structure formed over the solder joint. The first bump structure includes a first pillar layer formed over the substrate and a first barrier layer formed over the first pillar layer. The first barrier layer has a first protruding portion which extends away from a sidewall surface of the first pillar layer, and a distance between the sidewall surface of the first pillar layer and a sidewall surface of the first barrier layer is in a range from about 0.5 μm to about 3 μm. The second bump structure includes a second barrier layer formed over the solder joint and a second pillar layer formed over the second barrier layer, wherein the second barrier layer has a second protruding portion which extends away from a sidewall surface of the second pillar layer.