公开(公告)号：US20240190596A1

公开(公告)日：2024-06-13

申请号：US18513542

申请日：2023-11-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Yang-Ann CHU ,  Chieh-Chun LIN ,  Shine CHEN

IPC: B65B5/04 ,  B65G47/28 ,  G01N21/95 ,  G06T7/00

CPC classification number: B65B5/045 ,  G01N21/9501 ,  G06T7/0004 ,  B65G47/28

Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.

公开(公告)号：US20220185512A1

公开(公告)日：2022-06-16

申请号：US17686299

申请日：2022-03-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Yang-Ann CHU ,  Chieh-Chun LIN ,  Shine CHEN

IPC: B65B5/04 ,  G06T7/00 ,  G01N21/95

Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.