公开(公告)号：US11088109B2

公开(公告)日：2021-08-10

申请号：US16679733

申请日：2019-11-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Lin ,  Chien-Kuo Chang ,  Pu-Sheng Lee ,  Fu-Jen Li ,  Hsien-Liang Meng

IPC: H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L21/48 ,  H01L25/00 ,  H01L25/065

Abstract: A package includes a die on a surface of a package component. The package also includes a first die stack on the surface of the package component. The package further includes a first thermal interface material (TIM) having a first thermal conductivity and disposed on the first die stack. In addition, the package includes a second thermal interface material (TIM) having a second thermal conductivity and disposed on the die. The first thermal conductivity of the first TIM is different from the second thermal conductivity of the second TIM.

公开(公告)号：US11011487B2

公开(公告)日：2021-05-18

申请号：US16908388

申请日：2020-06-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Lin ,  Chien-Kuo Chang ,  Tzu-Kai Lan ,  Chung-Chih Chen ,  Jr-Lin Hsu

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor package is provided, including a package component and a number of conductive connectors. The package component has a number of conductive features on a surface of the package component. The conductive connectors are formed on the conductive features of the package component. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.

公开(公告)号：US10700030B2

公开(公告)日：2020-06-30

申请号：US16258888

申请日：2019-01-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Lin ,  Chien-Kuo Chang ,  Tzu-Kai Lan ,  Chung-Chih Chen ,  Jr-Lin Hsu

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor package is provided, including a package substrate, a package component, and a number of conductive connectors. The package component has a number of conductive features on a first surface of the package component facing the package substrate. The conductive connectors electrically connect the conductive features of the package component to the package substrate. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.