公开(公告)号：US11329006B2

公开(公告)日：2022-05-10

申请号：US16900815

申请日：2020-06-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H01L23/00 ,  H01L23/36 ,  H01L23/40 ,  H01L23/31

Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.

公开(公告)号：US10685920B2

公开(公告)日：2020-06-16

申请号：US15823474

申请日：2017-11-27

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H01L23/00 ,  H01L23/36 ,  H01L23/40 ,  H01L23/31

Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.

公开(公告)号：US11764169B2

公开(公告)日：2023-09-19

申请号：US17739990

申请日：2022-05-09

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H01L23/00 ,  H01L23/36 ,  H01L23/40 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L23/36 ,  H01L23/3128 ,  H01L23/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00

Abstract: A semiconductor device package includes a die, a molding layer, a heat spreader lid, and a warpage control adhesive layer. The molding layer surrounds the die. The molding layer has a first edge and a second edge at least partially defining a corner of the molding layer. The heat spreader lid covers the molding layer and the die. The warpage control adhesive layer is between the heat spreader lid and the molding layer. The warpage control adhesive layer is at the corner of the molding layer and has a bar shape in a top view, and the warpage control adhesive layer extends from the first edge toward the second edge of the molding layer.

公开(公告)号：US20190019760A1

公开(公告)日：2019-01-17

申请号：US15904657

申请日：2018-02-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yue-Lin Peng ,  Cheng-Yi Huang ,  Fu-Jen Li ,  Shou-Wen Kuo

IPC: H01L23/544 ,  H01L21/677

Abstract: A wafer includes a first face having a first center, and a second face having a second center. The first and second centers are each arranged on a central axis, which passes through the first face and the second face. The first face and the second face adjoin one another at a circumferential edge. An alignment notch is disposed along the circumferential edge, and extends inwardly from the circumferential edge by an alignment notch radial distance. The alignment notch radial distance is less than a wafer radius as measured from the first center to the circumferential edge. A die region includes an array of die arranged in rows and columns and is circumferentially bounded by a die-less region which is devoid of die. A first identification mark including a string of characters is disposed entirely in the die-less region to a first side of the alignment notch.

公开(公告)号：US09831190B2

公开(公告)日：2017-11-28

申请号：US14151217

申请日：2014-01-09

Applicant: Taiwan Semiconductor Manufacturing CO., LTD.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H01L23/00 ,  H01L23/40 ,  H01L23/34 ,  H01L23/36 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00

Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.

公开(公告)号：US11088109B2

公开(公告)日：2021-08-10

申请号：US16679733

申请日：2019-11-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Lin ,  Chien-Kuo Chang ,  Pu-Sheng Lee ,  Fu-Jen Li ,  Hsien-Liang Meng

IPC: H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L21/48 ,  H01L25/00 ,  H01L25/065

Abstract: A package includes a die on a surface of a package component. The package also includes a first die stack on the surface of the package component. The package further includes a first thermal interface material (TIM) having a first thermal conductivity and disposed on the first die stack. In addition, the package includes a second thermal interface material (TIM) having a second thermal conductivity and disposed on the die. The first thermal conductivity of the first TIM is different from the second thermal conductivity of the second TIM.

公开(公告)号：US11121093B2

公开(公告)日：2021-09-14

申请号：US16575761

申请日：2019-09-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yue-Lin Peng ,  Cheng-Yi Huang ,  Fu-Jen Li ,  Shou-Wen Kuo

IPC: H01L23/544 ,  H01L21/677 ,  H01L21/67 ,  H01L21/68

Abstract: A wafer includes a first face having a first center, and a second face having a second center. The first and second centers are each arranged on a central axis, which passes through the first face and the second face. The first face and the second face adjoin one another at a circumferential edge. An alignment notch is disposed along the circumferential edge, and extends inwardly from the circumferential edge by an alignment notch radial distance. The alignment notch radial distance is less than a wafer radius as measured from the first center to the circumferential edge. A die region includes an array of die arranged in rows and columns and is circumferentially bounded by a die-less region which is devoid of die. A first identification mark including a string of characters is disposed entirely in the die-less region to a first side of the alignment notch.

公开(公告)号：US20200013726A1

公开(公告)日：2020-01-09

申请号：US16575761

申请日：2019-09-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yue-Lin Peng ,  Cheng-Yi Huang ,  Fu-Jen Li ,  Shou-Wen Kuo

IPC: H01L23/544 ,  H01L21/677

Abstract: A wafer includes a first face having a first center, and a second face having a second center. The first and second centers are each arranged on a central axis, which passes through the first face and the second face. The first face and the second face adjoin one another at a circumferential edge. An alignment notch is disposed along the circumferential edge, and extends inwardly from the circumferential edge by an alignment notch radial distance. The alignment notch radial distance is less than a wafer radius as measured from the first center to the circumferential edge. A die region includes an array of die arranged in rows and columns and is circumferentially bounded by a die-less region which is devoid of die. A first identification mark including a string of characters is disposed entirely in the die-less region to a first side of the alignment notch.

公开(公告)号：US20150194389A1

公开(公告)日：2015-07-09

申请号：US14151217

申请日：2014-01-09

Applicant: Taiwan Semiconductor Manufacturing CO., LTD.

Inventor： Ming-Chih Yew ,  Fu-Jen Li ,  Po-Yao Lin ,  Kuo-Chuan Liu

IPC: H01L23/00 ,  H01L23/367

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00

Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.

Abstract translation: 在散热器盖的粘合表面和半导体封装的顶表面之间，除了吊具粘合剂层之外，还提供了几个翘曲控制粘合剂层。 翘曲控制粘合剂层设置在散热器盖的粘合表面的拐角区域，以减少半导体器件封装的高温翘曲。