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公开(公告)号：US20220316861A1
公开(公告)日：2022-10-06
申请号：US17846910
申请日：2022-06-22
发明人： Chih Hung CHEN , Kei-Wei CHEN , Te-Ming KUNG
摘要： A method of evaluating a thickness of a film on a substrate includes detecting atomic force responses of the film to exposure of electromagnetic radiation in the infrared portion of the electromagnetic spectrum. The use of atomic force microscopy to evaluate thicknesses of thin films avoids underlayer noise commonly encountered when optical metrology techniques are utilized to evaluate film thicknesses. Such underlayer noise adversely impacts the accuracy of the thickness evaluation.
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公开(公告)号：US20220415665A1
公开(公告)日：2022-12-29
申请号：US17355981
申请日：2021-06-23
发明人： Te-Chien HOU , Po-Chin NIEN , Chih Hung CHEN , Ying-Tsung CHEN , Kei-Wei CHEN
IPC分类号： H01L21/306 , B24B53/017 , B24B37/34
摘要： A chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with the chemical mechanical planarization pad during the process. A slurry supply system supplies a slurry onto the pad during the process. A pad conditioner conditions the pad during the process. An impurity removal system removes debris and impurities from the slurry.
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公开(公告)号：US20210364275A1
公开(公告)日：2021-11-25
申请号：US17194934
申请日：2021-03-08
发明人： Chih Hung CHEN , Kei-Wei CHEN , Te-Ming KUNG
摘要： A method of evaluating a thickness of a film on a substrate includes detecting atomic force responses of the film to exposure of electromagnetic radiation in the infrared portion of the electromagnetic spectrum. The use of atomic force microscopy to evaluate thicknesses of thin films avoids underlayer noise commonly encountered when optical metrology techniques are utilized to evaluate film thicknesses. Such underlayer noise adversely impacts the accuracy of the thickness evaluation.
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