公开(公告)号：US20220356574A1

公开(公告)日：2022-11-10

申请号：US17869706

申请日：2022-07-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-chun YANG ,  Yi-Ming LIN ,  Chih-tsung LEE ,  Yun-Tzu CHIU ,  Chao-Hung WAN

IPC: C23C16/44 ,  C23C16/458 ,  C23C16/50 ,  C23C16/455

Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.

公开(公告)号：US20210079524A1

公开(公告)日：2021-03-18

申请号：US16570274

申请日：2019-09-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-chun YANG ,  Yi-Ming LIN ,  Chih-tsung LEE ,  Yun-Tzu CHIU ,  Chao-Hung WAN

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/50 ,  C23C16/458

Abstract: Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.