公开(公告)号：US20230386884A1

公开(公告)日：2023-11-30

申请号：US18447519

申请日：2023-08-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shuang-Shiuan DENG ,  Fan-Chi LIN ,  Chueh-Chi KUO ,  Li-Jui CHEN ,  Heng-Hsin LIU

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/68721

Abstract: A method includes: positioning a wafer on an electrostatic chuck of an apparatus; and securing the wafer to the electrostatic chuck by: securing a first wafer region of the wafer to a first chuck region of the electrostatic chuck by applying a first voltage at a first time. The method further includes securing a second wafer region of the wafer to a second chuck region of the electrostatic chuck by applying a second voltage at a second time different from the first time; and processing the wafer by the apparatus while the wafer is secured to the electrostatic chuck.

公开(公告)号：US20220310431A1

公开(公告)日：2022-09-29

申请号：US17477450

申请日：2021-09-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shang-Shiuan DENG ,  Fan-Chi LIN ,  Chueh-Chi KUO ,  Li-Jui CHEN ,  Heng-Hsin LIU

IPC: H01L21/683 ,  H01L21/687

Abstract: A method includes: positioning a wafer on an electrostatic chuck of an apparatus; and securing the wafer to the electrostatic chuck by: securing a first wafer region of the wafer to a first chuck region of the electrostatic chuck by applying a first voltage at a first time. The method further includes securing a second wafer region of the wafer to a second chuck region of the electrostatic chuck by applying a second voltage at a second time different from the first time; and processing the wafer by the apparatus while the wafer is secured to the electrostatic chuck.