公开(公告)号：US11056459B2

公开(公告)日：2021-07-06

申请号：US16373900

申请日：2019-04-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hang Tung ,  Tung-Liang Shao ,  Su-Chun Yang ,  Geng-Ming Chang ,  Chen-Hua Yu

IPC: H01L23/00

Abstract: A method for forming a chip package structure is provided. The method includes partially removing a first redistribution layer to form an alignment trench in the first redistribution layer. The alignment trench surrounds a bonding portion of the first redistribution layer. The method includes forming a liquid layer over the bonding portion. The method includes disposing a chip structure over the liquid layer, wherein a first width of the bonding portion is substantially equal to a second width of the chip structure. The method includes evaporating the liquid layer. The chip structure is in direct contact with the bonding portion after the liquid layer is evaporated.