公开(公告)号：US12286706B2

公开(公告)日：2025-04-29

申请号：US17187410

申请日：2021-02-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yi Shen ,  Hsin-Lin Wu ,  Yao-Fong Dai ,  Pei-Yuan Tai ,  Chin-Wei Chen ,  Yin-Tun Chou ,  Yuan-Hsin Chi ,  Sheng-Yuan Lin

IPC: C23C14/56 ,  C23C14/50 ,  C23C16/455 ,  H01L21/687

Abstract: The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.