公开(公告)号：US11767336B2

公开(公告)日：2023-09-26

申请号：US17870324

申请日：2022-07-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsu-Kai Chang ,  Chi-Ming Yang ,  Jui-Hsiung Liu ,  Jui-Hung Fu ,  Hsin-Yi Wu

IPC: C07F7/22 ,  G03F7/004 ,  G03F7/36 ,  G03F7/20 ,  G03F7/32 ,  G03F7/30

CPC classification number: C07F7/2224 ,  G03F7/0042 ,  G03F7/30 ,  G03F7/36 ,  G03F7/2004 ,  G03F7/325

Abstract: The present disclosure is directed to organotin cluster compounds having formula (I) and their use as photoresists in extreme ultraviolet lithography processes.

公开(公告)号：US11579531B2

公开(公告)日：2023-02-14

申请号：US16583182

申请日：2019-09-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsu-Kai Chang ,  Chi-Ming Yang ,  Jui-Hsiung Liu ,  Jui-Hung Fu ,  Hsin-Yi Wu

IPC: G03F7/30 ,  G03F7/32 ,  G03F7/36 ,  G03F7/004 ,  C07F7/22 ,  G03F7/20

Abstract: The present disclosure is directed to organotin cluster compounds having formula (I) and their use as photoresists in extreme ultraviolet lithography processes.