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公开(公告)号：US11491510B2
公开(公告)日：2022-11-08
申请号：US15930570
申请日：2020-05-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： I-Hsuan Chiu , Chia-Ming Hung , Li-Chun Peng , Hsiang-Fu Chen
Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes an interconnect structure disposed over a semiconductor substrate. A dielectric structure is disposed over the interconnect structure. A plurality of cavities are disposed in the dielectric structure. A microelectromechanical system (MEMS) substrate is disposed over the dielectric structure, where the MEMS substrate comprises a plurality of movable membranes, and where the movable membranes overlie the cavities, respectively. A plurality of fluid communication channels are disposed in the dielectric structure, where each of the fluid communication channels extend laterally between two neighboring cavities of the cavities, such that each of the cavities are in fluid communication with one another.
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2.发明授权公开(公告)号：US11851323B2
公开(公告)日：2023-12-26
申请号：US16907607
申请日：2020-06-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsiang-Fu Chen , Chia-Ming Hung , I-Hsuan Chiu
CPC classification number: B81B7/02 , B81C1/00341 , B81B2201/0271 , B81B2203/0127 , B81B2203/0315 , B81B2207/07 , B81C2203/036
Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes an interconnect structure disposed over a semiconductor substrate. A dielectric structure is disposed over the interconnect structure. A first cavity and a second cavity are disposed in the dielectric structure. A microelectromechanical system (MEMS) substrate is disposed over the dielectric structure, where the MEMS substrate comprises a first movable membrane overlying the first cavity and a second movable membrane overlying the second cavity. A first functional structure overlies the first movable membrane, where the first functional structure comprises a first material having a first chemical composition. A second functional structure overlies the second movable membrane, where the second functional structure is laterally spaced from the first functional structure, and where the second functional structure comprises a second material having a second chemical composition different than the first chemical composition.
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3.发明申请公开(公告)号：US20210061647A1
公开(公告)日：2021-03-04
申请号：US16907607
申请日：2020-06-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsiang-Fu Chen , Chia-Ming Hung , I-Hsuan Chiu
Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes an interconnect structure disposed over a semiconductor substrate. A dielectric structure is disposed over the interconnect structure. A first cavity and a second cavity are disposed in the dielectric structure. A microelectromechanical system (MEMS) substrate is disposed over the dielectric structure, where the MEMS substrate comprises a first movable membrane overlying the first cavity and a second movable membrane overlying the second cavity. A first functional structure overlies the first movable membrane, where the first functional structure comprises a first material having a first chemical composition. A second functional structure overlies the second movable membrane, where the second functional structure is laterally spaced from the first functional structure, and where the second functional structure comprises a second material having a second chemical composition different than the first chemical composition.
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公开(公告)号：US20210060610A1
公开(公告)日：2021-03-04
申请号：US15930570
申请日：2020-05-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： I-Hsuan Chiu , Chia-Ming Hung , Li-Chun Peng , Hsiang-Fu Chen
Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes an interconnect structure disposed over a semiconductor substrate. A dielectric structure is disposed over the interconnect structure. A plurality of cavities are disposed in the dielectric structure. A microelectromechanical system (MEMS) substrate is disposed over the dielectric structure, where the MEMS substrate comprises a plurality of movable membranes, and where the movable membranes overlie the cavities, respectively. A plurality of fluid communication channels are disposed in the dielectric structure, where each of the fluid communication channels extend laterally between two neighboring cavities of the cavities, such that each of the cavities are in fluid communication with one another.
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