公开(公告)号：US20200091034A1

公开(公告)日：2020-03-19

申请号：US16419672

申请日：2019-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang SHAO ,  Jen-Yu WANG ,  Chung-Jung WU ,  Chih-Hang TUNG ,  Chen-Hua YU

IPC: H01L23/42 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/18

Abstract: A semiconductor package is provided. The semiconductor package includes a substrate and a semiconductor die over the substrate. A heat-dissipating feature covers the substrate and the semiconductor die, and a composite thermal interface material (TIM) structure is thermally bonded between the semiconductor die and the heat-dissipating feature. The composite TIM structure includes a metal-containing matrix material layer and polymer particles embedded in the metal-containing matrix material layer.