公开(公告)号：US20250118690A1

公开(公告)日：2025-04-10

申请号：US18482122

申请日：2023-10-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Yi Lin ,  Kan-Ju Yang ,  Kai-Cheng Chen ,  Chien-Li Kuo ,  Chien-Chen Li

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31

Abstract: A semiconductor package includes: a die having a conductive pad at a first side of the die; and a redistribution structure over the first side of the die and electrically coupled to the die. The redistribution structure includes: a first dielectric layer including a first dielectric material; a first via in the first dielectric layer, where the first via is electrically coupled to the conductive pad of the die; and a first dielectric structure embedded in the first dielectric layer, where the first dielectric structure includes a second dielectric material different from the first dielectric material, where the first dielectric structure laterally surrounds the first via and contacts sidewalls of the first via.